From September 10 to 12, 2025, the Shenzhen World Convention and Exhibition Center hosted the annual grand event in the semiconductor industry—the SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition. As a key player in the field of semiconductor packaging, Hiner-Pack made a stunning appearance with a series of cutting-edge solutions and innovative products in semiconductors and chips, showcasing the innovative achievements in the semiconductor industry alongside numerous high-quality enterprises in the sector, and attracting a large number of professional visitors to stop and exchange ideas.
This exhibition boasted a massive scale, with an exhibition area of 60,000 square meters, covering the entire semiconductor industry ecosystem, including end-use applications, chip design, wafer manufacturing, packaging and testing, equipment and materials, EDA/IP, and other links. At the same time, the exhibition was held concurrently and at the same venue as the 26th China International Optoelectronic Exposition (CIOE), creating a powerful industrial synergy of "optoelectronics + semiconductors" and bringing unprecedented cross-border cooperation opportunities for participating enterprises and visitors.
Hiner-Pack's booth (Booth Number: 14J03) attracted attention with its simple yet technologically sophisticated design. At this exhibition, we highlighted our new generation of semiconductor packaging products, which utilize newly developed high-performance composite materials. These products not only possess excellent anti-static and moisture-proof properties but also achieve a qualitative leap in dimensional stability and durability. In response to the needs of advanced packaging technologies, we have provided precisely adapted internal structural designs to ensure the safety and stability of semiconductor devices during transportation and storage.
During the exhibition, Hiner-Pack's professional team engaged in in-depth exchanges with numerous visitors, providing detailed introductions to our product advantages and technological innovation points. Many enterprise representatives from fields such as chip manufacturing and packaging and testing showed strong interest in our products and held discussions on potential cooperation. A purchasing manager from a well-known chip manufacturing enterprise said, "The innovations in materials and design of Hiner-Pack's packaging products perfectly meet our stringent requirements for semiconductor device packaging. We look forward to establishing a long-term and stable cooperative relationship in the future."
This participation in the exhibition was an important opportunity for Hiner-Pack to showcase its strength, expand industry exchanges, and grasp market trends. Through in-depth exchanges and cooperation with industry peers, we have further clarified market demands and technological development directions. In the future, Hiner-Pack will continue to increase its investment in research and development, continuously innovate, and strive to provide higher-quality and more efficient packaging solutions for the global semiconductor industry, helping the semiconductor industry reach new heights of development.
